| 发明名称 |
WAFER UNLOADING SYSTEM AND WAFER PROCESSING EQUIPMENT INCLUDING THE SAME |
| 摘要 |
A wafer unloading system and wafer processing equipment (system) including the same are disclosed. The wafer unloading system includes a fluid supply tube for supplying a fluid, a nozzle for injecting the supplied fluid, and an injection hole defined in a plate to allow the injected fluid to reach a space between a polishing pad and a wafer. |
| 申请公布号 |
EP2524391(A4) |
申请公布日期 |
2014.10.22 |
| 申请号 |
EP20100843278 |
申请日期 |
2010.12.16 |
| 申请人 |
LG SILTRON INC. |
发明人 |
AHN, JIN-WOO;CHOI, EUN-SUCK;KIM, BONG-WOO;YU, HWAN-SU;YI, JAE-HWAN |
| 分类号 |
H01L21/304;B24B37/34 |
主分类号 |
H01L21/304 |
| 代理机构 |
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