| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for observing the processing of a minute sample where the cross-sectional observation and analysis of a wafer cross section from a horizontal direction to a vertical direction can be performed with a high resolution, high precision and high throughput, without breaking a wafer being the sample. SOLUTION: This apparatus is provided with a focused ion beam optical system and an electron optical system in the same vacuum device, and provided with a probe separating a minute sample including the desired area of the sample by charged particle beam molding processing and picking up the separated minute sample. COPYRIGHT: (C)2006,JPO&NCIPI
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