| 发明名称 |
POSITIVE RESIST COMPOSITION |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive resist composition capable of forming a resist pattern having an excellent shape. <P>SOLUTION: In the positive resist composition prepared by dissolving a base resin component (A) and an acid generator component (B) which generates an acid upon exposure in an organic solvent, the base resin component (A) is a silicone resin and the organic solvent contains propylene glycol monomethyl ether (x1) and a solvent (S2) having a higher boiling point than the propylene glycol monomethyl ether. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
| 申请公布号 |
JP2005283991(A) |
申请公布日期 |
2005.10.13 |
| 申请号 |
JP20040098184 |
申请日期 |
2004.03.30 |
| 申请人 |
TOKYO OHKA KOGYO CO LTD |
发明人 |
KAWANA DAISUKE;YAMADA TOMOTAKA;HOSONO TAKAYUKI;TAMURA KOKI |
| 分类号 |
G03F7/039;G03F7/004;G03F7/075;H01L21/027 |
主分类号 |
G03F7/039 |
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