| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermal head which suppresses warpage due to thermal strain while cost reduction and miniaturization are realized, and moreover which can prevent printing density irregularities due to separation of an adhesive layer, and to provide its manufacturing method. <P>SOLUTION: The thermal head is equipped with a head substrate on a heat sink. The head substrate has a plurality of heating resistors which heat by energization, common electrodes connected to one ends of all heating elements, and a plurality of discrete electrodes connected to the other end of each heating resistor. A wide interval step part for widening a bonding face interval between the head substrate and the heat sink is provided at a position immediately below at least the plurality of heating resistors of the head substrate. An elastic adhesive with an elasticity which exerts the thermal strain absorbing capability is interposed at the bonding face between the head substrate and the heat sink including this wide interval step part. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
