发明名称 PHASE CHANGE HEAT-CONDUCTIVE MOLDING
摘要 PROBLEM TO BE SOLVED: To obtain a phase change heat-conductive molding, which has excellent heat conduction performance and readily increases handleability and transfer properties. SOLUTION: The phase change heat-conductive molding is obtained by molding a phase change heat-conductive composition, comprising a styrene-based elastomer, paraffin oil, a heat-conductive filler and a plasticizer having 40-60°C freezing point. The plasticizer in an amount of 50-400 parts wt. is added to the styrene-based elastomer in an amount of 100 parts wt. The plasticizer is preferably triphenyl phosphate. The phase change heat-conductive filler has a sheetlike form and is set to 50-300μm thickness at <40°C. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005281346(A) 申请公布日期 2005.10.13
申请号 JP20040093636 申请日期 2004.03.26
申请人 POLYMATECH CO LTD 发明人 FUJISAWA HIROYUKI
分类号 C08J5/00;C08K3/00;C08L9/06;C08L91/00;(IPC1-7):C08L9/06 主分类号 C08J5/00
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