LASER CUTTING METHOD AND DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a head for laser beam processing which can simultaneously achieve cutting surfaces symmetrical to the center line and expansion of a threshold plate thickness and is suitable for cutting of a thick plate.

SOLUTION: In the laser cutting method and device of cutting a workpiece by condensing a laser beam to the workpiece while passing an assist gas nearly coaxially with the laser beam and irradiating the workpiece with the laser beam, the condensed laser spots are vibrated in the range within 0.2 mm in the respective vibration axis directions on the surface of the workpiece with the direction (y) parallel to the cutting line and the direction (x) orthogonal with the cutting liner as vibration axes.

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