发明名称 |
FUNCTIONAL DEVICE PACKAGING MODULE, OPTICALLY FUNCTIONAL DEVICE PACKAGING MODULE, AND MANUFACTURING METHOD OF SAME |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an optically functional device packaging module capable of sufficiently transmitting a purple-blue laser beam and of being manufactured by a simple process, and provide its manufacturing method. <P>SOLUTION: An optically functional device packaging module connects a connection part 50 of a transparent substrate 2 with a bump 30 of an optically functional device 3 electrically and physically in such a state that an optically functional section 31 of the optically functional device 3 is arranged oppositely to the transparent substrate 2 with a predetermined wiring pattern 5 formed, and it is sealed by a sealing resin 6. There is provided a light-transmitting space 10 between the optically functional section 31 of the optically functional device 3 and the transparent substrate 2 by checking the sealing resin 6 by an inner pier portion 7. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
申请公布号 |
JP2005286284(A) |
申请公布日期 |
2005.10.13 |
申请号 |
JP20040135584 |
申请日期 |
2004.04.30 |
申请人 |
SONY CHEM CORP |
发明人 |
YONEDA YOSHIHIRO;MURANAKA HIDENOBU |
分类号 |
H01S5/022;H01L31/02;(IPC1-7):H01L31/02 |
主分类号 |
H01S5/022 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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