发明名称 FUNCTIONAL DEVICE PACKAGING MODULE, OPTICALLY FUNCTIONAL DEVICE PACKAGING MODULE, AND MANUFACTURING METHOD OF SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an optically functional device packaging module capable of sufficiently transmitting a purple-blue laser beam and of being manufactured by a simple process, and provide its manufacturing method. <P>SOLUTION: An optically functional device packaging module connects a connection part 50 of a transparent substrate 2 with a bump 30 of an optically functional device 3 electrically and physically in such a state that an optically functional section 31 of the optically functional device 3 is arranged oppositely to the transparent substrate 2 with a predetermined wiring pattern 5 formed, and it is sealed by a sealing resin 6. There is provided a light-transmitting space 10 between the optically functional section 31 of the optically functional device 3 and the transparent substrate 2 by checking the sealing resin 6 by an inner pier portion 7. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2005286284(A) 申请公布日期 2005.10.13
申请号 JP20040135584 申请日期 2004.04.30
申请人 SONY CHEM CORP 发明人 YONEDA YOSHIHIRO;MURANAKA HIDENOBU
分类号 H01S5/022;H01L31/02;(IPC1-7):H01L31/02 主分类号 H01S5/022
代理机构 代理人
主权项
地址