发明名称 |
Method and apparatus for establishing improved thermal communication between a die and a heatspreader in a semiconductor package |
摘要 |
A semiconductor package comprising a packaging substrate, a semiconductor die mounted with the substrate, a heatspreader, and a multi-layer heat transfer element arranged between the semiconductor die and the heat spreader to enable thermal communication between the die and the heat spreader is disclosed. The multi-layer heat transfer element includes a core spacer element sandwiched between a first layer of thermally conductive reflowable material and a second layer of thermally conductive reflowable material. Also disclosed are methods for forming such semiconductor packages and for forming multilayer heat transfer elements.
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申请公布号 |
US2005224955(A1) |
申请公布日期 |
2005.10.13 |
申请号 |
US20040820494 |
申请日期 |
2004.04.07 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
DESAI KISHOR V.;ALAGARATNAM MANIAM B. |
分类号 |
H01L21/48;H01L23/31;H01L23/34;H01L23/36;H01L23/433;(IPC1-7):H01L21/48 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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