发明名称 SPUTTERING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a sputtering apparatus which can perform reactive sputtering for a long time with a good yield. SOLUTION: The sputtering apparatus is equipped with a means for monitoring the state of a target 3 and shuts off electric power for deposition to be applied to the target 3 when the state thereof attains the prescribed state. Since the apparatus can substantially prevent the abnormal discharge due to a change in the state of the target 3, the reactive sputtering can be performed with the good yield for a long time. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005281741(A) 申请公布日期 2005.10.13
申请号 JP20040095159 申请日期 2004.03.29
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TACHIHATA NAOKI
分类号 C23C14/34;H01L21/31;(IPC1-7):C23C14/34 主分类号 C23C14/34
代理机构 代理人
主权项
地址