发明名称 SUBSTRATE HOLDING MECHANISM, AND SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a substrate holding mechanism having a mirror plane opposite to a substrate and including a spin base which essentially requires no reworking, and also to provide a substrate treatment apparatus and a substrate treatment method using the same. SOLUTION: A spin chuck 1 is composed of the spin base 11 and substrate holding pins 12. A rotary shaft 21 which is rotated by a rotation driving mechanism 2 is connected to the bottom surface of the spin base 11. A treatment liquid is supplied to the substrate S held by the spin chuck 1 from a top face treatment liquid supplying mechanism 3 and a bottom face treatment liquid supplying mechanism 4. The spin base 11 is formed of a silicon carbide material containing no metal assistant, and its surface including the plane 11a opposite to the substrate is mirror-finished. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005285798(A) 申请公布日期 2005.10.13
申请号 JP20040092764 申请日期 2004.03.26
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 OKUNO EIJI
分类号 G02F1/13;B05D1/40;G02F1/1333;H01L21/304;H01L21/306;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 G02F1/13
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