发明名称 |
Method for manufacturing semiconductor device |
摘要 |
In a production of a semiconductor device, after a step in which a thermosetting resin is thermally cured to seal a semiconductor chip with the resin and before a step in which a characteristic of the semiconductor chip is inspected, the thermosetting resin is baked at a temperature higher than the resin sealing temperature in said resin sealing step.
|
申请公布号 |
US2005227384(A1) |
申请公布日期 |
2005.10.13 |
申请号 |
US20040519175 |
申请日期 |
2004.12.20 |
申请人 |
|
发明人 |
NAGANO KOUTA;MIURA HIDEO;YAGUCHI AKIHIRO |
分类号 |
H01L21/56;H01L23/31;(IPC1-7):G01R31/26 |
主分类号 |
H01L21/56 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|