Front opening wafer carrier with path to ground effectuated by door

摘要

A front opening wafer carrier formed principally of plastic and comprising an enclosure portion ( 20 ) and a door ( 24 ) has a path to ground with respect to the wafers ( 22 ), the path to ground effectuated by the door ( 24 ). The base "ground" may be provided at the machine interface upon which the carrier sits, or through the robotic arm that grasps, operates and moves the door ( 24 ).