| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power semiconductor device equipped with an insulating circuit substrate comprising a ceramic board to which a metal board is bonded, which withstands repeated tests to provide excellent reliability, and reduced thermal resistance from a chip to a heatsink. <P>SOLUTION: In the power semiconductor device equipped with an insulating circuit board comprising a ceramic board 3 and a heatsink 2 which are bonded together, the ceramic board and heatsink are directly bonded. This enables the semiconductor device to withstand repeated tests (thermal cycle tests) and obtain excellent reliability, and to simultaneously reduce a thermal resistance (transient thermal resistance) from a chip to a heatsink, thus stabilizing chip characteristics as well as preventing a thermal failure to obtain reliability. When the ceramic substrate and heatsink metal, such as Cu or the like, are bonded by an alloy including resin, it is possible to reduce the warpage of the substrate after bonding which is caused by a difference in coefficient of linear expansion between ceramic and metal, thereby enabling the reduction of a stress occurring on the chip or ceramic substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
