发明名称 PHOTOELECTRON INTEGRATED DEVICE AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a photoelectron integrated device, wherein a silicon substrate with an integrated circuit formed and an active layer, especially, a compound semiconductor layer comprising a laser oscillating portion are integrated. <P>SOLUTION: The device has a growth support layer 2 positioned on a silicon substrate 1, an ELO layer 3, consisting of a compound semiconductor layer formed by epitaxial lateral growth on the growth supporting layer and an active layer 4, which is positioned above the ELO layer and comprises an n-type layer and a p-type layer of the compound semiconductor. In the ELO layer, a window 2a which is a groove provided along the peripheral edge of the growth support layer is embedded, and is formed in the lateral direction on the growth support layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005286018(A) 申请公布日期 2005.10.13
申请号 JP20040096322 申请日期 2004.03.29
申请人 SUMITOMO ELECTRIC IND LTD;NARIZUKA SHIGEYA;MARUYAMA TAKAHIRO 发明人 NARIZUKA SHIGEYA;MARUYAMA TAKAHIRO;MORIWAKE TATSUYA
分类号 H01L33/30;H01S5/323 主分类号 H01L33/30
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