| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LSI package with an interface module that is simple in structure, manufactured in an existing manufacturing line, and excellent in high frequency characteristic, and to provide an interposer substrate for use in the LSI package with the interface module, and a transmission line header inserted into receptacles of the package. <P>SOLUTION: The package has a signal processing LSI (LSI chip) 5; an interposer substrate 1 that has the LSI chip 5 mounted thereon and is electrically connected to a mounting board; receptacles 21 to 24 that are provided on the interposer substrate 1 and form a part of a mechanism forming an interface between a signal of the LSI chip 5 and an external transmission line; and a plurality of transmission line headers 31, 32, ... that have interface IC chips forming a part of the interface, and are inserted into the receptacles 21 to 24 to radiate heat from the interface IC chips via receptacles 21 to 24. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
