| 发明名称 |
Wiring board and production method of wiring board |
| 摘要 |
A wiring board comprises a substrate; a resin layer which is selectively formed on one main surface of the substrate and has fine metal particles contained or adhered to its surface; and a conductive metal layer which is formed on the resin layer with the fine metal particles interposed between them.
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| 申请公布号 |
US2005224253(A1) |
申请公布日期 |
2005.10.13 |
| 申请号 |
US20050103462 |
申请日期 |
2005.04.12 |
| 申请人 |
AOKI HIDEO;TAKUBO CHIAKI;YAMAGUCHI NAOKO |
发明人 |
AOKI HIDEO;TAKUBO CHIAKI;YAMAGUCHI NAOKO |
| 分类号 |
H05K3/18;H05K1/03;H05K1/09;H05K3/10;H05K3/24;H05K3/46;(IPC1-7):H05K1/03 |
主分类号 |
H05K3/18 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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