发明名称 In-situ surface treatment for memory cell formation
摘要 A system and methodology are disclosed for forming a passive layer on a conductive layer, such as can be done during fabrication of an organic memory cell, which generally mitigates drawbacks inherent in conventional inorganic memory devices. The passive layer includes a conductivity facilitating compound, such as copper sulfide (Cu<SUB>2</SUB>S), which is generated from an upper portion of a conductive material. The conductive material can serve as a bottom electrode in the memory cell, and the upper portion of the conductive material can be transformed into the passive layer via treatment with a plasma generated from fluorine (F) based gases.
申请公布号 US2005227382(A1) 申请公布日期 2005.10.13
申请号 US20040817131 申请日期 2004.04.02
申请人 HUI ANGELA T 发明人 HUI ANGELA T.
分类号 H01L21/00;H01L21/311;(IPC1-7):H01L21/66 主分类号 H01L21/00
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