| 发明名称 |
Method and apparatus for electroplating |
| 摘要 |
Apparatus and method for metal electroplating. The apparatus for metal electroplating includes an electroplating tank for containing an electrolyte at a first temperature, a substrate holder for holding a semiconductor substrate, and a heater for heating the portion of the electrolyte adjacent to the substrate holder to a second temperature higher than the first temperature.
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| 申请公布号 |
US2005224359(A1) |
申请公布日期 |
2005.10.13 |
| 申请号 |
US20040814175 |
申请日期 |
2004.04.01 |
| 申请人 |
SU HUNG-WEN;SHIH CHIEN-HSUEH;TSAI MING-HSING |
发明人 |
SU HUNG-WEN;SHIH CHIEN-HSUEH;TSAI MING-HSING |
| 分类号 |
C25D5/00;C25D7/12;C25D17/00;C25D17/02;H01L21/288;(IPC1-7):C25D7/12 |
主分类号 |
C25D5/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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