HIGH FREQUENCY PACKAGE, TRANSMITTING AND RECEIVING MODULE AND WIRELESS EQUIPMENT

摘要

A multilayer dielectric substrate (23) is provided with a signal via (65), which is connected with a bias/control signal terminal of a high frequency semiconductor (43) and is arranged on the inner side of electromagnetic shield members (24) and (25), a signal via (65), which is arranged on the outer side of the electromagnetic shield members (24) and (25) and is connected with a bias/control signal external terminal (51), an inner layer signal line (60), which connects these signal vias (65), an inner layer grounding conductor (70), which is arranged around the signal vias (65) and the inner layer signal line (60), and a plurality of grounding vias (75), which are arranged around the signal vias (65) and the inner layer signal line (60) on the inner layer grounding conductor (70). At least on an upper surface or a lower surface of the inner signal line (60), a resistance film (80) is provided, and leakage of high frequency components to the external is suppressed within a high frequency package.