ADHESIVE COMPOSITION FOR SEMICONDUCTOR, AND ADHESIVE SHEET FOR SEMICONDUCTOR USING THE SAME, SUBSTRATE FOR CONNECTING SEMICONDUCTOR INTEGRATED CIRCUIT, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition for a semiconductor device having excellent laser machining performance, and to provide a substrate for connecting a semiconductor integrated circuit having a high adhesive force, high reflow-proof nature and a semiconductor device in terms of a performance.

SOLUTION: The adhesive composition used for the semiconductor device contains at least one kind of thermoplastic resin, thermosetting resin, and an inorganic particle as a composition. The inorganic particle is mica coated with a metal oxide on its surface.

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