| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package by which high airtightness is attained even if a base material consisting of WCu alloy, WAg alloy, MoCu alloy and MoAg alloy is used. SOLUTION: A semiconductor carrier includes a substrate 10 formed by any of the WCu alloy, the WAg alloy, the MoCu alloy or the MoAg alloy, and a hermetic seal 16 of the substrate 10 and a plurality of lead terminals (lead wires) 14 is directly joined not through a nickel plating layer. Moreover, a weld portion 17a of the substrate 10 and a seal ring 17 is directly joined not through the nickel plating layer. Nickel plating 18a and gold plating 18b are applied to a surface of the lead terminals (the lead wires) 14 after hermetic sealing and to a surface of the seal ring 17 after welding. COPYRIGHT: (C)2006,JPO&NCIPI |
