| 摘要 |
PROBLEM TO BE SOLVED: To obtain a flexible printed circuit board small in dimension change rate which does not cause a change in dimension in forming a circuit by removing the unnecessary part of a metallic conductor by etching. SOLUTION: This manufacturing method of the flexible printed circuit board made of a conductor layer and a polyimide layer includes steps of directly applying a polyimide precursor resin solution on a conductor, drying, and curing by thermal treatment. The method is characterized in that a ratio of making the polyimide precursor resin layer into imide is controlled to a range of 12-18%, before the curing process carried out after drying at 150°C or lower and carried out at a drying temperature or higher. COPYRIGHT: (C)2006,JPO&NCIPI
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