| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film for a semiconductor with a dicing sheet function, wherein an adhesive-bond layer is laminated only to a wafer attachment intended portion. SOLUTION: The adhesion film for the semiconductor with a dicing sheet function is constituted in such a way that an adhesive layer 4 may be formed on a base film 5, a film-like adhesive layer 3 may be formed on it, and the outer diameter of the adhesive layer 3 may be larger than the outer diameter of the attachment intended portion of the wafer 1 and smaller than the inner diameter of the wafer ring attachment intended portion. It is preferable that the glass transition temperature of the resin composition consisting of the adhesive layer 3 exists between -30°C or more and 60°C or less. COPYRIGHT: (C)2006,JPO&NCIPI |
