| 摘要 |
An enclosure for operationally retaining a plurality of electronic modules has a housing comprising front, side, upper, lower, and rear walls, and housing enclosing an inner volume. The enclosure has an inner wall running between the side walls and attached to the lower wall. The inner wall is positioned between the front and back walls, and splits the inner volume into a first inner volume and a second inner volume. The inner wall extends from the bottom wall to a height less than that of the height of said top wall, and defines an opening between the first inner volume and the second inner volume. An exhaust vent is disposed through the rear wall of the housing. Openings exist in the housing into the first inner volume. This allows an airflow into the first inner chamber. An environmental flow mechanism, such as a fan, is coupled in proximity to the exhaust vent. The environmental flow mechanism is directionally oriented to create an airflow from the upper portion of the housing outwards through the exhaust vent. The interaction of the directionally drawn air from the top of the casing and the inner wall of blocking an air flow in a lateral direction produces a flow of air in a particular orientation. The flow of air originates from the openings of the housing, moves upwards and laterally to the environmental flow opening, and outwards through the vent.
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