| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board wherein an interface between metal to be formed with a circuit and substrate resin is smoothed, thereby obtaining excellent micro-circuit formability or high frequency characteristic. SOLUTION: The wiring board contains the metal to be formed with a circuit and the substrate resin, and contains a resin layer which differs from the substrate resin between the metal and the substrate resin. The resin layer contains an amide group of 4 mol% or more. COPYRIGHT: (C)2005,JPO&NCIPI
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