| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming the electrode circuit pattern of a MID substrate at a low production cost. SOLUTION: An electrode circuit pattern 23 is formed on a resin sheet 24 with conductive resin adhesives, and an air pressure is applied to the resin sheet 24 forming the electrode circuit pattern 23 in a heated state, to make it into a shape which is engaged with the recess shape of a substrate blank 22. The shaped resin sheet 24 is pressurized and adhered to the substrate blank 22 through adhesives 25 in the heated state. Au plating is performed on the electrode circuit pattern 23 to form the electrode circuit pattern of the MID substrate. COPYRIGHT: (C)2005,JPO&NCIPI
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