发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT, ELECTRIC OPTICAL DEVICE AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor film for improving the characteristics of elements such as a thin film transistor at the time of forming a semiconductor film by carrying out melting and crystallization using micropores. SOLUTION: This method for manufacturing a semiconductor film comprises a micropore formation process for forming a micropore (14) in an insulating film (12) formed on a substrate (10); a first film formation process for forming a non-single crystal semiconductor film (16) in the micropore and on the insulating film; a melting and crystallizing process for melting and crystallizing the non-single crystal semiconductor film, and for forming a first crystal semiconductor film (18) with the micropore as almost a center; and a second film formation process for forming a second crystal semiconductor film (20) by epitaxially growing the semiconductor on the first crystal semiconductor film. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005268441(A) 申请公布日期 2005.09.29
申请号 JP20040076808 申请日期 2004.03.17
申请人 SEIKO EPSON CORP 发明人 SHIMADA HIROYUKI
分类号 H01L51/50;C30B29/06;C30B29/52;H01L21/20;H01L21/205;H01L21/336;H01L29/786;H05B33/14;(IPC1-7):H01L21/20 主分类号 H01L51/50
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