| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device formed by storing and airtightly sealing a microelectronic machine mechanism in a recessed part formed on a main surface of a semiconductor substrate; and a manufacturing method capable of manufacturing the electronic device superior in productivity and reliability. <P>SOLUTION: This electronic device 12 has an elctronic part sealing substrate 6 forming a wiring conductor 2 over the other main surface from one main surface of an insulating substrate 1, forming a connecting pad 3 for installing a first joining material 5 on one main surface and attached with a second joining material 4 so as to surround the connecting pad 3, and an electronic part 10 forming the microelectronic machine mechanism 8 on a bottom surface of the recessed part 13 of the main surface of the semicoductor substrate 7 and forming an electrode 9 connected to the microelectronic machine mechanism 8 on the main surface of the semiconductor substrate 7. The electrode 9 of the electronic part 10 and the connecting pad 3 are joined and connected by the first joining material 5, and the second joining material 5 is joined to the main surface of the semiconductor substrate 7. The microelectronic machine mechanism 8 is airtightly sealed inside the second joining material 5 in a plan view. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
