| 摘要 |
A lead frame, a photodetector mounted on the lead frame and a signal processing section that is mounted on the lead frame and electrically connected to the photodetector are provided. A first sealing portion fabricated of a translucent resin that seals the photodetector and the signal processing section is provided. A second sealing portion fabricated of a conductive resin that covers the first sealing portion is provided. The conductive resin, which constitutes the second sealing portion, is made of polycarbonate and a conductive additive.
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