| 发明名称 |
THERMALLY CONDUCTIVE MATERIAL FOR ELECTRONIC AND/OR ELECTRICAL COMPONENTS, AND USE THEREOF |
| 摘要 |
The invention relates to a thermally conductive and electrically insulating material, especially a paste, for mounting electrical and/or electronic components in housings and/or on cooling elements. Said material is free of silicons and has a high filling ratio with moderate viscosity. |
| 申请公布号 |
WO2005090478(A2) |
申请公布日期 |
2005.09.29 |
| 申请号 |
WO2005EP51056 |
申请日期 |
2005.03.09 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT;HEINL, DIETER;DECKER, MICHAEL;BAYER, HEINER |
发明人 |
HEINL, DIETER;DECKER, MICHAEL;BAYER, HEINER |
| 分类号 |
C08G59/62;C08G59/68;C08K3/34;H01B3/02 |
主分类号 |
C08G59/62 |
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