| 摘要 |
PROBLEM TO BE SOLVED: To solve problems of electrical conduction such as exfoliation of an interface between a wiring conductor layer, and a through conductor owing to the concentration of stress around an outermost wiring conductor layer, and the through conductor due to a difference of linear expansion coefficients between the wiring conductor layer and the through conductor and the insulating layer upon the through conductors being superimposed vertically, in the multilayer wiring board where the wiring conductor layer and the resin insulating layer are stacked in multilayer. SOLUTION: The multilayer wiring board is so configured that the resin insulating layer 2 and the wiring conductor layer 3 are stacked alternately into plural layers, and the upper and lower wiring conductor layers 3 are electrically connected via the through conductor 6 formed on the insulating layer 2 located therebetween. In the multilayer wiring board, the through conductor 6 on the lower side is superimposed on the through conductor 6 formed on the insulating layer 2 of the uppermost layer such that they are continuous vertically. Further, an upper end of the through conductor 6 formed on the insulating layer 2 of the uppermost layer is protruded from the insulating layer 2. COPYRIGHT: (C)2005,JPO&NCIPI |
