| 摘要 |
PROBLEM TO BE SOLVED: To provide a miniaturizable pressure sensor having excellent corrosion resistance. SOLUTION: Patterned wiring 32b, 32c is sealed by a resin sheet 31 on a wiring board 30. Each wiring 32b, 32c on the wiring board 30 is bonded to a pad 14 of a pressure sensor chip 10, and each wiring 32b, 32c on the wiring board 30 is bonded to exposure parts of connection terminals 20b, 20c, respectively, and each bonded part is sealed by the resin sheet 31 on the wiring board 30. COPYRIGHT: (C)2005,JPO&NCIPI
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