首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
MANUFACTURING METHOD OF A VERY THIN AND SMALL CHIP PACKAGE HAVING NO SUBSTRATE
摘要
申请公布号
KR100519625(B1)
申请公布日期
2005.09.29
申请号
KR20050008410
申请日期
2005.01.31
申请人
S-PACKAGE SOLUTION CO., LTD.
发明人
KONG, KYEONG JUN;LEE, WON OH;CHOI, YOUN SIK;HWANG, SANG YONG;OH, GI TEAK
分类号
H01L23/00;H01L23/02;(IPC1-7):H01L23/02
主分类号
H01L23/00
代理机构
代理人
主权项
地址
您可能感兴趣的专利
WHEELCHAIR HAVING AN UMBRELLA ASSEMBLY
MOTORIZED TENSIONING SYSTEM
FOOTWARE SECURING DEVICE
LACELESS SHOE
Sole Structures And Articles Of Footwear Having An Elongated Hexagonal Siping Pattern And/Or A Heel Pocket Structure
Body Wear Accessories
MENS UNDERWEAR BRIEF
VAPORIZER DEVICE WITH IMPROVED THREADED CONNECTION
ELECTRONIC VAPORISER SYSTEM
METHOD FOR MANUFACTURING CURVED EDGE CIGARETTE ROLLING PAPER
METHOD FOR EXTRACTING CONTAMINANTS FROM AGRARIAN PRODUCTS AND APPARATUS THEREFOR
WILDLIFE DETERRENCE USING MONO-COLORED LIGHT TO INDUCE NEUROPHYSICAL BEHAVIORAL RESPONSES IN ANIMALS
MELON HYBRID SVMF5196 AND PARENTS THEREOF
POTATO CULTIVAR Y9
METHODS AND APPARATUSES FOR TREATING AGRICULTURAL MATTER
COMPOSITIONS COMPRISING EICOSAPENTAENOIC ACID AND A HYDROXYL COMPOUND AND METHODS OF USE THEREOF
COMPONENT MOUNTER
THERMAL MODULE ASSEMBLING STRUCTURE
ELECTRONIC MODULE WITH FREE-FORMED SELF-SUPPORTED VERTICAL INTERCONNECTS
Cable Assembly Management Elements and Fixture
