| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an information processor capable of connecting a substrate side connector projected from a second substrate to a mother side connector without excessively deflecting a first substrate to deform it by pushing the first substrate in the connecting direction. <P>SOLUTION: The information processor is provided with a plurality of spacers 13 interposed between the first substrate 11 and the second substrate 12 to connect the first substrate 11 to the second substrate 12, the substrate side connector 14 separated from the plurality of spacers 13 and projected from a back surface of the second substrate 12 and connected to the mother side connector 202 of a mother board 200 from the connecting direction crossing both the substrates 11 and 12, and a deformation preventing block 15 positioned on a surface side of the substrate side connector 14 and interposed between the first substrate 11 and the second substrate 12 to transmit pushing force in the connecting direction of the first substrate 11 to the substrate side connector 14 through the second substrate 12 and having insulating performance at least in a surface and a back surface thereof. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
