| 摘要 |
PROBLEM TO BE SOLVED: To perform flattening processing of a bump upper surface in a high yield with high throughput, by efficiently and highly accurately measuring flatness of a processing surface, in the flattening processing of the bump upper surface. SOLUTION: This processing apparatus is formed into a structure capable of measuring processing accuracy of a silicon wafer W on a rotary table device 20 by a measuring instrument 85, only by moving a Y axis moving table 14 to a measuring work area B by a shaft feeding means of the Y axis. COPYRIGHT: (C)2005,JPO&NCIPI
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