SEMICONDUCTOR CHIP AND LAMINATED SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a laminated semiconductor device that is less in structural restriction and can be manufactured at a low cost, and to provide a semiconductor chip used for the semiconductor device.

SOLUTION: The laminated semiconductor device has a first semiconductor chip having first on-chip wiring on its first main surface, a second semiconductor chip laminated upon the first main surface and having second on-chip wiring on its second main surface, and a plurality of external connection wiring electrically connected to the first on-chip or second on-chip wiring. The second on-chip wiring is formed on the second main surface so that the wiring may be extended from the first end side to the second end section side of the main surface and electrically connected to the first on-chip wiring or external connection wiring.

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