| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer circuit wiring board which can assure the reliability even under a temperature variation of electrical joining in a solder reflowing process which is carried out to electrically join a semiconductor element with the multi-layer circuit wiring board and a mounting substrate using the multilayer circuit wiring board. SOLUTION: The above problem is resolved by that the stiffener is provided so that a bonding portion and a gap portion are located in the bonding area of the stiffener on the substrate, and the multilayer circuit wiring is fixed through the bonding portion of an area smaller than the area of the bonding area. COPYRIGHT: (C)2005,JPO&NCIPI
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