发明名称 HEATSINK WITH MULTIPLE, SELECTABLE FIN DENSITIES
摘要 A heat sink (100) for use with a heat generating device, that includes: a base member (110); a fixed set of adjacent heat dissipating surfaces (120) formed in the base member (110) for causing the heat sink (100) to have a predetermined low power dissipation level that is a function of the number of heat dissipating surfaces (120) in the fixed set; and at least one groove (130) formed in the base member (110) between each two adjacent heat dissipating surfaces (120) in the fixed set for enabling an additional heat dissipating surface to be securedly attached to the base member (110) in each groove (130) for enabling the heat sink to have a power dissipation level that is in excess of the predetermined low power dissipation level as a function of the number of additional heat dissipating surfaces attached to the base member (110).
申请公布号 EP1579165(A2) 申请公布日期 2005.09.28
申请号 EP20030799884 申请日期 2003.12.09
申请人 MOTOROLA, INC. 发明人 TUROCY, JAMES;WIDMAYER, ROBERT
分类号 F28F3/04;H01L23/367;(IPC1-7):F28F7/00;H05K7/20;H01L23/34 主分类号 F28F3/04
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