Lead frame and semiconductor device

摘要

A lead frame for use with a plastic encapsulated semiconductor device includes a tab (4) on which the semiconductor chip (9) is mounted, chip pad supporting leads (5), inner leads (2a) to be electrically coupled with the semiconductor chip, outer leads (2b) formed in a monoblock structure together with the inner leads, and a frame (1) for supporting the chip pad supporting leads and outer leads. In the lead frame, there is disposed a dam member (3) only between the outer leads. Alternatively, dummy outer leads are formed between the frame and leads adjacent thereto so as to connect the dummy leads to the outer leads by the dam member. The frame is removed after the semiconductor device is assembled.