| 摘要 |
<p>A thermosetting resin composition which contains: (A) an epoxy resin having at least two epoxy groups per molecule; (B) a hardener; (C) a compound represented by the following general formula (1) or (2); and (D) a microcapsule type hardening accelerator containing microcapsules each having a structure made up of a core containing a hardening accelerator and a shell covering the core and containing a polymer having a structural unit represented by the following general formula (3), and which, when examined by differential scanning calorimetry at a heating rate of 10 DEG C/min, shows an exothermic peak due to reaction in the range of from 180 to 250 DEG C, and a semiconductor device obtained through sealing with the composition are described. <IMAGE></p> |
