PROCEDE DE FABRICATION D'UN COMPOSANT OU D'UN MODULE ELECTRONIQUE ET COMPOSANT OU MODULE CORRESPONDANT

摘要

The method involves embedding an electronic module with an insulating material. A conducting zone is provided on the insulating material such that the zone receives interconnection unit of the electronic module. The conducting zone has an interconnection structure that allows to support the electronic module on printed circuit. The interconnection structure has an interconnection point extending on lateral edge of module. An independent claim is also included for an electronic module mounted on a printed circuit.