发明名称 RESIN COMPOSITION AND DECORATIVE BOARD MATERIAL
摘要 PROBLEM TO BE SOLVED: To obtain a decorative board material that has excellent abrasion resistance and causes no emission of formaldehyde. SOLUTION: This decorative board material comprises the core layer, the pattern layer and the like. As at least pattern layer, (A) a hydrophobic silica dispersing element prepared by dispersing hydrophobic silica in a resin and/or an organic solvent, (B) a compound bearing both of a polymerizable unsaturated group and an isocyanate group in one molecule and (C) a catalyst are mixed and heated to prepare a resin composition. Further, (D) a polymerization initiator is added to the composition and paper is impregnated with the resultant resin solution and dried to prepare the resin-impregnated pattern paper. Then, the pattern paper is thermally compressed together with the core layer. The proportion of the hydrophobic silica is 10 to 30 pts.wt. per 100 pts.wt. of the component (B). COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005255782(A) 申请公布日期 2005.09.22
申请号 JP20040067378 申请日期 2004.03.10
申请人 AICA KOGYO CO LTD 发明人 OGINO TOMOYA;KAEDE KAZUKI;SUZUKI YASUSHI
分类号 B27D5/00;B27M3/00;C08K5/16;C08K9/04;C08L101/00;E04F13/18;(IPC1-7):C08L101/00 主分类号 B27D5/00
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