发明名称 MOLDING METHOD OF GLASS SUBSTRATE AND GLASS SUBSTRATE MOLDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of surely and easily releasing a glass substrate stuck to a mold. SOLUTION: This molding method of a glass substrate includes a process (a, b) in which the surface shapes of molds 2 and 3 are transferred to a heated glass material 1 by pressurizing with a plurality of heated molds 2 and 3, a process (c) in which the pressure of molds 2 and 3 on the glass material 1 is decreased and the temperature of the glass 1 is lowered, a process (d) in which the surface of the glass material 1 is exposed as a free surface by increasing the gap between molds 2 and 3, thus moving the mold 3 from the surface of the glass 1, and a process (e, f) in which a gap is formed at least partly between the mold 3 which has been closely attached to the glass material 1 and the glass material 1 by rapidly cooling the free surface of the glass 1, thus releasing the glass substrate comprising the glass material 1 from the mold 3. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005255453(A) 申请公布日期 2005.09.22
申请号 JP20040068308 申请日期 2004.03.11
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HAMADA TAIZO
分类号 C03B11/00;G11B5/84;(IPC1-7):C03B11/00 主分类号 C03B11/00
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