发明名称 METHOD AND DEVICE FOR SEPARATING COMBINED DISK SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a device capable of surely peeling (separating) a transfer release disk substrate and a base material layer disk substrate from each other. <P>SOLUTION: The method for separating a transfer release disk substrate 10 from a combined disk substrate where a base material disk substrate 9 and the transfer release disk substrate 10 made of a more fragile material are stuck together includes the step of pressing the peripheral edge of the transfer release disk substrate from above in the supported state of the combined disk substrate from bottom, the step of bending it to the base material layer disk substrate side to break the transfer release disk substrate, and the step of detaching the broken transfer release disk substrate 10 off from the base material layer disk substrate 9 in a state where a thin film sheet is left on the base material layer disk substrate 9. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005259208(A) 申请公布日期 2005.09.22
申请号 JP20040066375 申请日期 2004.03.09
申请人 KITANO ENGINEERING CO LTD 发明人 KITANO RIYOUKO;AMO MITSUKUNI
分类号 G11B7/24;G11B7/26 主分类号 G11B7/24
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