| 摘要 |
PROBLEM TO BE SOLVED: To apply a liquid phase film formation method to a formation film with high film thickness uniformity in which a film having uniform film thickness is formed on the recess/projection structure surface by the liquid phase film formation method, in particular, on a recess/projection structure surface of an atmospheric pressure support member constituting an atmospheric pressure-resistance structure in an image formation device utilizing release of an electron. SOLUTION: A resin 2 is filled in a recess part of a substrate 1 by resin solution coating (Fig. (b)). A first film 3A is formed by coating with a solution of a film material containing no component dissolving the resin 2 (Fig. (c)). A second part 3A2 of the first film is remained on a projection part by dissolving the resin 2 by a solvent and removing with a first part 3A1 of the first film formed on the resin (Fig. (d)). A second film 3B is formed on the recess part by coating with the solution of the film material and a surface of the recess/projection structure is covered with the second part 3A2 of the first film and the second film 3B (Fig. (e)). A film 3' having good uniformity is formed on the recess/projection structure surface of the substrate 1 by calcining it (Fig. (f)). COPYRIGHT: (C)2005,JPO&NCIPI
|
