发明名称 IC SOCKET
摘要 PROBLEM TO BE SOLVED: To obtain reliability of stable electrical connection of an IC package and a socket housing without shaving a peripheral wall of a mounting face on which the IC package is mounted with the edge of the IC package, even if the IC package is arranged and shifted from a specified position of the socket housing and pressed in the IC socket. SOLUTION: A metal plate 100 guiding the IC package 200 to be pressed is provided at least in a part of the peripheral wall 24 of the mounting face 30 of the socket housing 2. The metal plate 100 has a shape flush with or projected over the top face 118 of the peripheral wall 24 and flush with or projected inside of the inner surface 120 of the peripheral wall 24. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005259572(A) 申请公布日期 2005.09.22
申请号 JP20040070546 申请日期 2004.03.12
申请人 TYCO ELECTRONICS AMP KK 发明人 HASHIMOTO SHINICHI
分类号 H01R33/76;H01R13/62;H05K7/10;(IPC1-7):H01R33/76 主分类号 H01R33/76
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