| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of mounting a semiconductor element on a BGA tape by which positioning, mounting and chip connection can be performed in a single process to simply improve productivity by mounting the semiconductor element on the flexible BGA tape by using a laminate roll. SOLUTION: The BGA tape 10 having an underfill layer 21 formed by applying a liquid resin to serve as an underfill material to a film base 11 having solder bumps 31 formed on an electrode 13 is prepared. The solder bump 31 of the BGA tape 10 and a bump electrode 42 of a semiconductor element 41 carried on a conveyance tray 51 are positioned on a pressurizing table 71 and pressurized by the laminate roll 61 heated to a predetermined temperature. Thus, the semiconductor element 41 can be mounted on the BGA tape 10. COPYRIGHT: (C)2005,JPO&NCIPI
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