| 摘要 |
PROBLEM TO BE SOLVED: To obtain a PWM modular structure capable of improving reliability in packaging components, reducing a cost, reducing radio noise by improving shielding effects, preventing radio wave interference, improving assembly when joining a substrate and a case to improve mass productivity, and further preventing a failure from occurring due to a solder ball during a subsequent robot soldering process. SOLUTION: A single PWM modular substrate 27 has all packaged components 26 including a resistor element, a microcomputer and a MOS 16 provided on a packaging surface 27a of an approximately rectangular planar printed board 22. The substrate 27 is received and retained within a case 28 having a heat sink 31 with the packaging surface facing the heat sink 31 and a non-packaging surface 27b facing outward. COPYRIGHT: (C)2005,JPO&NCIPI
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