发明名称 |
Semiconductor apparatus |
摘要 |
A semiconductor apparatus includes a substrate and elements or semiconductor chips provided on the substrate. The elements are sealed by being brought into contact with a sealing compound. The surface of contact on the elements or the sealing compound is plasma treated. The semiconductor chip is adhesively attached to another semiconductor chip via an adhesive compound. The surface of the semiconductor chip in contact with the adhesive compound is plasma treated.
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申请公布号 |
US2005205996(A1) |
申请公布日期 |
2005.09.22 |
申请号 |
US20050082150 |
申请日期 |
2005.03.16 |
申请人 |
USUI RYOSUKE;NISHIDA ATSUHIRO;MIZUHARA HIDEKI;NAKAMURA TAKESHI |
发明人 |
USUI RYOSUKE;NISHIDA ATSUHIRO;MIZUHARA HIDEKI;NAKAMURA TAKESHI |
分类号 |
H01L21/56;H01L23/31;H01L23/48;H01L25/16;H05K1/02;H05K3/28;H05K3/38;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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