| 摘要 |
PROBLEM TO BE SOLVED: To provide the structure of a thermoelectric element suitable for being incorporated in a semiconductor device. SOLUTION: The semiconductor device comprises a semiconductor substrate and a thermoelectric element formed thereon. The thermoelectric element comprises a first conductivity type region formed on the semiconductor substrate, a primary electrode connected electrically with one end of the first conductivity type region, and a secondary electrode connected electrically with the other end of the first conductivity type region. In the semiconductor device of such an arrangement, a temperature difference brought about by a current flowing between the primary and secondary electrodes can be used for cooling, heating, generating a heat flow, or controlling the temperature of the semiconductor substrate at least partially. COPYRIGHT: (C)2005,JPO&NCIPI |
